Build India's Next Chip Design Centre VLSI, Verification, DFT, and Chiplet Architecture

Name: Netskill LMS/LXP
Brand: Sansovi
Rating: 5 (1 reviews)

Sansovi GCC’s ChipCore CoE provides ISM scheme navigation, EDA ecosystem access, and India’s deepest chip design talent pipeline compressing semiconductor GCC setup from 12 months to under 6.

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Our Customers

GoodWorks Group, trusted by everyone. Fortune 500 to Startups.

60+

Semiconductor GCCs in Karnataka

60%

ISM DLI scheme application compressed

200+

Pre-vetted VLSI engineers on bench

Our Track Record

GCC Success Stories

Saptharushi

Saptharushi India Global Capability Centre (GCC)

Cyber Security

SINGAPORE

Mercedes-Benz

Mercedes-Benz Research & Development India

Automotive

GERMANY

Tesco

Tesco Bengaluru Global Capability Centre

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What Sansovi GCC Does in Semiconductor Design & Engineering

Sansovi GCC’s ChipCore CoE is India’s specialist advisor for semiconductor design GCC establishment. We bring together deep VLSI domain expertise, EDA ecosystem relationships, India Semiconductor Mission (ISM) scheme navigation, and proven GCC setup capability. Our VLSI GCC Setup Blueprint and ISM Navigation Guide compresses the standard semiconductor GCC setup timeline and eliminates the ISM scheme application complexity that most new entrants underestimate.

We work with global fabless semiconductor companies, IDMs, IP companies, EDA vendors, and semiconductor design services firms building India design centres. Whether you are exploring India for the first time, scaling an existing centre, or reviving a stalled GCC, our engagement begins where you are not where a standard playbook says you should be.

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The Challenge We Solve

Semiconductor GCCs face unique setup challenges: EDA tool licensing (Cadence, Synopsys, Siemens) is expensive and complex without pre-negotiated CoE access; ISM DLI scheme eligibility and MeitY reporting requirements are opaque; the VLSI talent market requires a completely different sourcing strategy from general software engineering; and HIL/SIL lab compute infrastructure for simulation workloads must be provisioned before the first engineer is hired.

EDA Tool Onboarding Delays

Onboarding EDA platforms such as Cadence Genus, Innovus, and Synopsys Design Compiler can take 4–6 months without established vendor relationships and pre-negotiated access.

India Semiconductor Mission DLI Scheme Complexity

Applying under the Design Linked Incentive scheme requires specialist understanding of eligibility criteria, documentation, and application timelines. Missing the right window can delay access to government incentives.

Shortage of RTL & UVM Engineering Talent

Experienced RTL designers and UVM verification engineers can take 12–16 weeks to hire from the open market in India without specialized semiconductor talent sourcing.

Semiconductor Compute Infrastructure Planning

Chip design teams require high-memory servers, EDA compute environments, storage, and increasingly GPU infrastructure for ML-assisted EDA workloads. These requirements should be sized before scaling the engineering team.

Constantly Evolving Regulatory Frameworks

RISC-V vs ARM Platform Strategy

Choosing between RISC-V and ARM at the GCC formation stage can influence architecture, tooling, licensing, talent requirements, and product roadmaps for several years.

Our Services — End-to-End or Modular

Every engagement is tailored. You can commission the full GCC lifecycle or engage us for a specific service. Nothing is bundled by default.

GCC Strategy & Business Case

Semiconductor sector landscape, ISM ecosystem analysis, Bengaluru vs Hyderabad analysis, fabless vs design services operating model, business case for HQ

ISM / MeitY Navigation

DLI scheme eligibility assessment, MeitY application preparation and submission support, reporting framework setup, IESA relationship facilitation

Entity & Legal Setup

Legal entity formation, MeitY registration, FEMA compliance for R&D GCC, IP ownership and transfer pricing for semiconductor IP, employment contracts for technical staff

Workspace — GoodWorks

Managed offices with high-density compute infrastructure. Server room capacity for EDA workloads. Proximity to IIT Bengaluru and IESA ecosystem.

EDA Tool Setup & Licensing

Pre-negotiated access to Cadence, Synopsys, and Siemens EDA university and commercial programmes. Tool stack selection, licensing model optimisation, compute sizing for P&R and simulation workloads.

Talent Acquisition

RTL designers, UVM verification engineers, DFT/ATPG engineers, physical design leads, RISC-V firmware developers. Pre-vetted bench: 200+ chip design specialists, 4-week deployment.

Operating Model & Governance

VLSI GCC team topology, reporting structure, tape-out calendar, IP governance framework, design review cadence, foundry interface protocol

GCC REVIVE — Semiconductor

Mandate reset for stalled chip design centres, EDA licence optimisation, talent restructure, ISM compliance recovery, HQ realignment

L&D — NetSkill

VLSI upskilling: SystemVerilog, UVM, formal verification, physical design, DFT, RISC-V. Delivered at GCC campus or online via NetSkill.

How We Deliver — Three Layers

Layer 1 — Knowledge

Sector research, regulatory intelligence, talent landscape analysis, technology benchmarking, and peer GCC performance data. You make decisions with full market context.

Layer 2 — Setup & Build

Entity formation, workspace (GoodWorks managed offices), team hiring, technology platform selection, compliance framework setup, and operating model design.

Shortage of Clinical Data Management Talent

Layer 3 — Growth & Optimisation

Mandate expansion, capability upgrade, leadership development (IIGC / NetSkill), GCC health diagnostics (REVIVE framework), and ongoing advisory.

Practice Areas & Technology Coverage

Our ChipCore practice covers the full chip design stack — from RTL development and verification through physical design, DFT, and advanced chiplet architecture.

VLSI & Physical Design

RTL design in SystemVerilog/VHDL, floorplanning and place-and-route, static timing analysis (STA), analog and mixed-signal design, custom layout, and GDSII sign-off. Full RTL-to-GDSII flow expertise using industry-standard EDA tools.

Verification & Validation

UVM testbench development, formal property verification, hardware emulation (Cadence Palladium), post-silicon debug and validation, coverage-driven verification methodology, and IP/SoC-level verification planning.

Design for Test (DFT)

Scan insertion and ATPG, EDT compression, BIST implementation, boundary scan (IEEE 1149.1/JTAG), yield diagnosis, and failure analysis for complex SoC designs including AI accelerators and automotive-grade chips.

Firmware & HW-SW Co-Design

RISC-V and ARM Cortex firmware development, HAL/BSP design, SystemC TLM virtual prototyping, device driver development, hardware-software co-simulation, and embedded OS porting for custom silicon.

Chiplet & Advanced Packaging

UCIe and BoW die-to-die interface design, 2.5D/3D IC architecture (HBM, CoWoS, FOPLP), AI accelerator chip architecture, interposer design, and advanced packaging integration engineering for heterogeneous compute platforms.

Ready to Build Your Semiconductor Design & Engineering GCC?

Chip design is among the most technically demanding GCC mandates. The ChipCore CoE team brings ISM policy navigation, EDA ecosystem access, and VLSI domain depth that no generic GCC advisor can match.

Talk to a ChipCore CoE Specialist

News and Updates

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Aug 11, 2026

End-to-End GCC Setup in India: The Complete Operator Guide

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Aug 10, 2026

Transfer Pricing in India 2026: What the New 15.5% Safe Harbour Rate Means for Your GCC Structure

Transfer pricing in India changed on April…

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Co-Employment Risk in India: What Every US Company Using an EOR Must Contractually Protect

Co-employment risk in India does not disappear…

Frequently Asked Questions

The DLI (Design Linked Incentive) scheme under India’s Semiconductor Mission provides financial support for semiconductor design companies — covering product development expenses, capital expenditure on EDA tools, and deployment-linked incentives. Eligibility depends on incorporation status, R&D spend thresholds, and product category. The application process involves MeitY registration, technical review, and milestone-based disbursement. Our ISM Navigation Guide and MeitY application support compresses the typical 6-month application cycle to under 10 weeks.

For a greenfield VLSI GCC, the recommended stack is: Cadence Xcelium for simulation (industry-standard for UVM verification), JasperGold for formal verification, Innovus for place-and-route, and Synopsys PrimeTime for static timing analysis. For analog/mixed-signal: Cadence Virtuoso. For DFT: Siemens Tessent. Start with university/startup programme licences (significantly cheaper) and migrate to commercial licences as headcount scales. Our pre-negotiated CoE rates reduce tool onboarding cost by approximately 35% vs. direct vendor negotiation.

From our ChipCore Setup Blueprint: RTL Design 15 engineers (30%), Verification (UVM + Formal) 18 engineers (36%), DFT/ATPG 6 engineers (12%), Physical Design/STA 6 engineers (12%), Firmware/HW-SW Co-Design 5 engineers (10%). Senior leadership: India Engineering Head + 2 function leads (Verification Lead + Physical Design Lead) hired before team build begins. This topology scales linearly to 200+ without structural change.

The Design Linked Incentive (DLI) scheme is MeitY’s financial support programme for semiconductor design. It covers up to 50% of eligible product development expenditure (capped at ₹15 Cr per product), capital support for EDA tool acquisition, and deployment-linked incentives when products reach defined revenue milestones. For a new VLSI GCC, DLI can materially reduce EDA tooling costs and R&D spend in the first 3 years. Eligibility requires incorporation in India, R&D mandate, and product development (not pure services) activity.

SansoviGCC by GoodWorks Group is India’s Leading End-to-End GCC Solutions Platform to build, operate and scale GCCs.

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